Electromigration

H.W. Zandbergen

Real time electron microscopy movie of changes in an Au line (100 nanometer wide in horizontal direction and 10 nm thick in the viewing direction) due to electromigration. The test specimen (see bottom left) is made by conventional cleanroom processes. For the experiments a special specimen holder was made (see bottom right). The electrons flow from left to right through the Au line. Due to electromigration (momentum transfer of electrons to the Au atoms) voids are formed. Once these voids are formed they tend to grow leading to the final collapse of the contact line.

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